Multi-objective Design Optimization of Multi-floor, Counterflow Micro Heat Exchangers

Author(s): 
Abas Abdoli, George S. Dulikravich (Florida International University)

Heat removal capacity, coolant pumping pressure drop and surface temperature non-uniformity are three major challenges facing single-phase flow microchannel compact heat exchangers. In this paper multi-objective optimization has been performed to increase heat removal capacity, and decrease pressure drop and temperature non-uniformity in single-flow microchannels. Three-dimensional (3D) 4-floor branching networks have been applied to increase heat removal capacity of a microchannel from silicon substrate (15x15x2 mm). Each floor has four different branching sub-networks with opposite flow direction with respect to the next one. Each branching network has four inlets and one outlet. However, branching patterns of each of these sub-networks could be different from the others. Conjugate heat transfer analysis has been performed by developing a software package which uses quasi-1D thermo-fluid analysis and a 3D steadt heat conduction analysis. These two solvers are coupled through their common boundaries representing surfaces of the cooling microchannels. Using quasi-1D solver significantly decreases computing time and its results are in good agreement with 3D Navier-Stokes equations solver for these types of application. The analysis package is capable of generating 3D branching networks with random topologies. 1341 random cooling networks were simulated using this analysis package. Multi-objective optimization using modeFrontier software was performed using response surface approximation and genetic algorithm. Diameters and branching pattern of each sub-network and coolant flow direction on each floor were design variables of multi-objective optimization Maximizing heat removal capacity, minimizing pressure drop and temperature non-uniformity on the hot surface were three simultaneous objectives of the optimization. Pareto-optimal solutions demonstrate that thermal loads of up to 500 W/cm² can be managed with 3D 4-floor microchannel cooling networks.

 

 

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